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NANOPACK SESSION @THERMINC'09 |
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A special NANOPACK session was held during the 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC, in Leuven, Belgium, on 9th October 2009. Nine scientific papers related to NANOPACK subjects were presented and discussed by project partners and external speakers. This session was a very good opportunity to discuss and compare the different approaches, and will serve to gain new ideas to achieve the goals of the NANOPACK projects.
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IBM's workshop on thermal management |
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On 1st July 2009, IBM organized for the consortium a very successful workshop on keys aspects of thermal management and packaging issues in electronics from system point of view down to nanoelectronics.
| Title |
Speaker |
| Introduction |
Dr Afshin Ziaei, TRT
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Nanotechnology and Si nanowires overview
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Dr. Walter Riess, IBM, ZRL
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Thermodynamics of datacenters and Green IT
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Dr. Bruno Michel, IBM, ZRL
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More than Moore by (N)MEMS on CMOS
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Dr. Michel Despont, IBM, ZRL
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Interlayer cooling in vertically integrated packages
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Thomas Brunschwiler, IBM, ZRL
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Thermal management challenges in power electronics
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Dr. Bruno Agostini, ABB
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Advance molecular modeling applications
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Dr. Alessandro Curioni, IBM, ZRL
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Hybrid atomistic/continuum simulations of Carbon Nanotubes in water environment
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Dr. Jens Walther, ETH
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Thermal transport modeling of a thin Si suspended membrane with stretched Ge quantum dots
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Dr. Jean-Numa Gillet, IEMN
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Swiss Micro-Nanotechnology Network
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Dr. Peter Vettiger, CSEM & IMT EPFL, Neuchatel, Switzerland
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ISL Demo
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Dr. Maria Soimu
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| Molecular Simulation of Thermal Transport |
Prof. Müller-Plathe, Germany |
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Chalmers' workshop on “Thermal transport in electronics and MEMS" |
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On 26th February 2009, Chalmers organized a very successful workshop hold in Gothenburg on “Thermal transport in electronics and MEMS” . This event, sponsored by NANOPACK, the Swedish Foundation for Strategic Research (SSF) ProViking program, Swedish National Science Foundation, and IEEE CPMT Nordic chapter, gathered academic and industrial experts of thermal management issues in electronics and allowed to present the project and to establish contacts with external partners.
| Title |
Speaker |
| General introduction |
Lars Frenning, Swedish Foundation for Strategic Research
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How to enhance productivity of Swedish electronics industry
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Prof Anders Kinnander, Chalmers University of Technology, Sweden |
Nanoscale Thermal transport
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Prof Gerald Mahan, Penn State University, USA |
| Outcome from the first year work of the FP7 EU NANOPACK program on thermal dissipation for Electronics and MEMS systems |
Dr Afshin Ziaei and Sebastien Demoustier , Thales Research, France |
Design of low-power integrated circuits
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Prof Per Larsson-Edefors, Chalmers University of Technology, Sweden
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Use of scanning probes for thermal transport measurements
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Dr Olivier Chapuis, ICN, Spain |
| User's view: Barriers arising due higher level of integration in communication systems |
Per Ingelhag, Ericsson, Sweden |
Thermal properties of example molecular nanostructures: Self-assembled quantum-dot arrays and nanowires connected to substrates
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Dr. Jean-Numa Gillet, University of Lille, IEMN, France
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Interface-limited thermal transport
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Prof Per Hyldgaard, Chalmers University of Technology, Sweden
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| Development of Nano-Thermal Interface Materials for Heat dissipation in electronics and MEMS systems |
Björn Carlberg, Chalmers University of Technology, Sweden
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Molecular dynamic modeling and simulation for thermal transport in electronics
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Dr Javier Goicochea, IBM Zürich, Switzerland
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Use of Carbon Nanotubes for heat dissipation in electronics and MEMS systems
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Teng Wang, Chalmers University of Technology, Sweden |
| Thermal Conductivity Measurement using Pulse Transient Hot Strip method |
Mattias Gustavsson, Hotdisc AB, Sweden |
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NANOPACK at the THERMINIC Workshop! |
NANOPACK will be first presented in detail to the thermal management community at the at the 14th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC , that will be held in Rome Italy, 24-26 September 2008.
The workshop will feature a special NANOPACK half day. Within this half day 2 sessions are planned. The first one will give a short overview of the project itself to the international thermal management community. This session starts with a general presentation of the project, and will be continued by presenting the scientific results achieved so far within the project. The second session will include talks that are in close relation with the subject of the NANOPACK project, but not from NANOPACK authors. This session will give a very good opportunity to discuss and compare the different approaches, and will serve to gain new ideas to fine tune the ways to pursue in order to achieve the goals of the NANOPACK projects.
Download Here the THERMINIC'08 Call of Papers.
Download Here the THERMINIC'08 Technical Program.
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Articles in refereed journals and magazines
| Article |
Partner |
Yifeng Fu, Teng Wang, Ove Jonsson and Johan Liu, “Application of Through-Silicon-Via technology for in-situ temperature monitoring on thermal interface”, submitted to Journal of Micromechanics and Microengineering.
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FOAB
Chalmers |
Ming Hu, Javier V. Goicochea, Bruno Michel, and Dimos Poulikakos, “Thermal rectification at the interface of water and self-assembled monolayers on silica surfaces,” Applied Physical Letters, 2009 (accepted).
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IBM
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| E.H. El Boudouti, B. Djafari Rouhani, A. Akjouj, L. Dobrzynski, “Acoustic waves in solids and fluids layered materials”, Review paper to be published in Surface Science Reports |
IEMN |
Johan Liu, Teng Wang and Eleanor E.B. Campbell, “Thermal management technologies for electronics based on multiwalled carbon nanotube bundles”, IEEE Nanotechnology Magazine, Vol 3 No 1, March 2009
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Chalmers |
Björn Carlberg, Teng Wang, Johan Liu and Dongkai Shangguan, “Polymer-metal nano-composite films for thermal management”, Microelectronics International, Volume 26, Number 2, 2009, 28–36
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Chalmers |
| B. Smith, W. Glatz, and B. Michel, “Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significanc”e, Electronics Cooling Magazine, February 2009, Article 2. |
IBM |
Philipp A.E. Schoen, Bruno Michel, Alessandro Curioni, Dimos Poulikakos, “Hydrogen-bond enhanced thermal energy transport at functionalized, hydrophobic and hydrophilic silica–water interfaces”, Chemical Physics Letters 476 (2009) 271–276.
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IBM |
J. Groenen, F. Poinsotte, A. Zwick, C.M. Sotomayor Torres, M. Prunnila, and J. Ahopelto, “Inelastic light scattering by longitudinal acoustic phonons in thin silicon layers: From membranes to silicon-on-insulator structures”, Physical Review B 77, 045420 (2008)
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ICN
VTT
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Y. Pennec, B. Djafari Rouhani, H. Larabi, J. Vasseur and A.C. Hladky-Hennion, “Low frequency gaps in a phononic crystal constituted of cylindrical dots deposited on a thin homogeneous plate”, Phys. Rev. B78, 104105/1-8 (2008)
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IEMN |
Conference Proceedings
| Proceeding |
Partner |
J .-N. Gillet, “Size Effects on the Thermal Properties of Self-assembled Ge Quantum Dots in Single-crystal Silicon”, in Nanoscale Heat Transport — From Fundamentals to Devices, edited by Rama Venkatasubramanian (Mater. Res. Soc. Symp. Proc. Volume 1172E, Warrendale, PA, 2009), 1172-T06-02
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IEMN
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Björn Carlberg and Johan Liu , “Development of new materials and processes for microsystem heat dissipation applications using nanotechnology”, Submitted to Swedish Production Symposium, Göteborg, Sweden, October 2009
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Chalmers |
Yifeng Fu, Teng Wang, Johan Liu, “Development of a test platform for thermal characterization using Through-Silicon-Via technology”, accepted IMAPS Nordic Chapter, Sept 16/19, 2009, Oslo, Norway
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Chalmers
FOAB
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P.-O. Chapuis, M. Schmidt, N. Kehagias, J. Cuffe, M. Prunnila, J. Ahopelto and C.M. Sotomayor Torres, “3-omega measurements of thermal conductivities of materials designed for low Thermal Interface Resistances”, TNT2009, Barcelona (Spain), September 2009, Poster
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ICN
VTT
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Johan Liu, “Use of Carbon Nanotubes for Potential Packaging Applications”, Invited Paper, IEEE Nanotech, July 28-31, 2009, Genoa, Italy.
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Chalmers |
Yifeng Fu, Teng Wang and Johan Liu, “Carbon Nanotubes as Cooling Fins in Microelectronic Systems”, 9th IEEE Nanotechnology Conference, July 28-31, 2009, Genoa, Italy, pp. 10-15.
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Chalmers
FOAB
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Nabi Nabiollahi, Johan Liu, Zhili Hu, Yan Zhang, Yue Cong, Zhaonian Cheng and Masahiro Inoue, “FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives”, IEEE Nanotech, July 26-30, 2009, Genoa, Italy
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Chalmers |
V Székely, G Somlay, P G Szabó, E.Kollar, and M. Rencz, “A sophysticated method for static testing of TIMs”, in Proceedings of the International Electronics Packaging Conference, Interpack 2009, July 19-23, 2009, San Francisco, CA, USA, ASME no.: IPACK2009-89363
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MicReD
BME
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E.H. L Boudouti, Y. EL Hassouani, B. Djafari-Rouhani, “Acoustic waves in layered media: comparative study of Raman scattering and reflection delay time”, 15th International Conferenceon Photoacoustic and Photothermal Phenomena (ICPPP15), Leuven (Belgium), July 19-23, 2009 Manuscript submitted to Journal of Physics: Conference Series
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IEMN |
Pierre-Olivier Chapuis, Michael Schmidt, Nikos Kehagias, John Cuffe, Mika Prunnila, Jouni Ahopelto, Clivia M. Sotomayor Torres, “3-omega measurements of thermal conductivities of materials designed for low thermal resistances”, 15th International Conference on Photoacoustic and Photothermal Phenomena (ICPPP15), Leuven (Belgium), July 19-23, 2009, Poster
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ICN
VTT
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B. Djafari-Rouhani, Y. Pennec, H. Larabi, J.N. Gillet, J. Vasseur, A. Hladky, “Band structure and phonon transport in a phononic crystal made of periodic array of dots on a membrane”, Invited paper at the First International Workshop on Phononic Crystal, Nice, France, 23-26 June 2009
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IEMN |
Cong, Yue, Yan Zhang, Zhaonian Cheng and Johan Liu, “Influences of Filler Geometry and Content on Effective Thermal Conductivity of Thermal Conductive Adhesive”, Proc. IEEE CPMT Conference on Electronics Component Technology (ECTC) 2009, San Diego, USA, May 26-29, 2009, pp. 2055-2059.
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Chalmers |
B. Djafari-Rouhani, Y. Pennec, H. Larabi, “Band structure and phonon transport in a phononic crystal made of a periodic array of dots on a membrane”, Invited paper at IUTAM Symposium on Recent Advances of Acoustic Waves in Solids, Taipei, 25-28 May 2009, Springer Science (In Press)
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IEMN |
Pierre-Olivier Chapuis, Michael Schmidt, John Cuffe, Mika Prunnila, Jouni Ahopelto and Clivia M Sotomayor Torres, “3ω measurement of thermal conductivities of Thermal Interface Materials in the range 10-300 K”, Materials Research Society (MRS) Spring Meeting, San Francisco, April 13-17, 2009
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ICN
VTT
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Yan Zhang, Cong Yue, Johan Liu, Zhaonian Cheng and Jing-yu Fan, “Study of the Filler Effect on the Effective Thermal Conductivity of Thermal Conductive Adhesive”, International Conference on Electronics Packaging (ICEP 2009), Paper 16B1-1-3, Kyoto, 14-16 April 2009
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Chalmers |
M. Inoue and J. Liu, “Thermal conductivity of Electrically Conductive Adhesives Containing Fillers with Multi-modal Particle Size Distributions”, International Conference on Electronics Packaging (ICEP 2009), Paper 16B1-1-4, Kyoto, 14-16 April 2009
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Chalmers |
B. Smith, A. Bonetti, T. Gnos, and B. Michel, “Flow-induced Spatial Non-uniformity and Anisotropy in Electrically Conductive Adhesives”, SEMI-THERM 2009, March 17-20, San Jose, California.
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IBM |
B. Djafari-Rouhani, Y. Pennec, H. Larabi, “Band structure and wave guiding in a phononic crystal constituted by a periodic array of dots deposited on a homogeneous plate”, Invited paper at SPIE Photonic West, San Jose, 24-29 January 2009, Proc. SPIE, Vol. 7223 (Photonic and Phononic Crystal Materials and Devices IX), 72230F (2009);
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IEMN |
S. Demoustier, C. Sarno and A. Ziaei, “NANOPACK – Nano Packaging Technology for Interconnect and Heat Dissipation”, accepted at 4th IMAPS Workshop on Micropackaging and Thermal Management, La Rochelle, France, Jan. 2009
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TRT
THAV
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András Poppe, Andras Vass-Varnai, Gábor Farkas, Marta Rencz, “Package characterization: simulations or measurements?”, Proceedings of the 10th Electronics Packaging Technology Conference (EPTC'08). Singapore, Singapore, 2008.12.10-12
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MicReD
BME
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Y. Pennec, B. Djafari-Rouhani, J Vasseur, and A.C. Hladky-Hennion, “Phononic crystals and manipulation of sound”, Invited paper at EMRS fall meeting, Warsaw (Poland), 15-19 September 2008, Physica status Solidi (C) to be published
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IEMN |
Clivia M. Sotomayor Torres, “Thermal conductivity in nanostructures: the role of acoustic phonons”, Invited Paper 14th Therminic 2008, Rome, Italy, Sept. 2008
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ICN |
V. Székely, G. Somlay, P. G. Szabó, M. Rencz, “Design of a static TIM tester”, Proceedings of the 14th International Workshop on THERMal INvestigations of ICs and Systems (THERMINIC'08). Rome, Italy, 2008.09.24-26
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MicReD
BME
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J. Liu, R. Miessner, K.-V. Schuett, B. Michel, M. Rencz, C. Tantoli, C. Sarno and A. Ziaei, “Recent Progress of Thermal Interface Material Research – An Overview”, Proc 14th Therminic 2008, Rome, Italy,Sept. 2008
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Chalmers, Bosch, IBM, THAV, BME, TRT
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B. Djafari Rouhani, Y. Pennec, J. Vasseur and A.C. Hladky-Hennion, “Band gap in a phononic crystal constituted by a periodical array of dots on a plate”, Proc 14th Therminic 2008, Rome, Italy, Sept. 2008
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IEMN |
A. Ziaei, S. Demoustier, “NANOPACK – Nano Packaging Technology for Interconnect and Heat Dissipation”, Proc 14th Therminic 2008, Rome, Italy, Sept. 2008
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TRT |
D. May, B. Wunderle, M. Abo Ras, W. Faust, A. Gollhard, R. Schacht and B. Michel, “Material Characterization and Non-Destructive Failure Analysis by Transient Pulse Generation and IR-Thermography”, Proc 14th Therminic 2008, Rome, Italy, Sept. 2008
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IZM
Nanotest
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B. Wunderle, J. Kleff, D. May, M. Abo Ras, R. Schacht, H. Oppermann, J. Keller and B. Michel. “In-situ measurement of various thin Bond-Line-Thickness Thermal Interface Materials with Correlation to Structural Features”. Proc 14th Therminic 2008, Rome, Sept 24-26 2008
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BME |
A. Vass-Várnai, M. Rencz, “Testing interface thermal resistance”, Proceedings of eTherm'08 - The 1st International Symposium on Thermal Design and Thermophysical Property for Electronics. Tsukuba, Japan, 2008.06.18-20.
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TRT |
A. Ziaei, S. Demoustier, “NANOPACK - Nano Packaging Technology for Interconnect and Heat Dissipation”, 3rd e-CUBES Workshop at ESSDERC/ESSCIRC 2008, Edinburgh, UK, Sept. 2008
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TRT |
Xia Zhang, Teng Wang and Johan Liu, “Overview of Carbon NanoTube for Electronic Interconnect”, 2nd Electronics System-Integration Technology Conference, London, UK, Sept. 2008
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Chalmers |
Yi Fan, Teng Wang, Yan Zhang, Johan Liu, Zhaonian Cheng, Xiaojin Wang, “Development of Heat Sink Performance of Microcooler Using Nanofluids Containing Carbon Nanotubes”, 2nd Electronics System-Integration Technology Conference, London, UK, Sept. 2008
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Chalmers |
Masahiro Inoue and Johan Liu, “Electrical and thermal properties of electrically conductive adhesives using a heat-resistant epoxy binder”, 2nd Electronics System-Integration Technology Conference, London, UK, Sept. 2008
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Chalmers |
Björn Carlberg, Teng Wang, Yifeng Fu and Johan Liu, “Preparation of Polymer-metal Nanocomposite Films and Performance Evaluation as Thermal Interface Material”, 2nd Electronics System integration Technology Conference, London, UK, 2008
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Chalmers
FOAB
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Johan Liu, Björn Carlberg, Teng Wang, Masahiro Inoue, “Overwiew of Recent Progress of Thermal Interface Materials”, 2nd Electronics System-Integration Technology Conference, London, UK, Sept. 2008
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Chalmers |
Yi Fan, Yifeng Fu, Johan Liu, Teng Wang, Yan Zhang, Xiaojing Wang, Zhaonian Cheng, “A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers”, 9th International Conference on Electronic Packaging technology and High Density Packaging, Shanghai, China, July 2008
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Chalmers |
Cong Yue, Yan Zhang, Johan Liu, Zhaonian Cheng, “Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material”, 9th International Conference on Electronic Packaging technology and High Density Packaging, Shanghai, China, July 2008
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Chalmers |
Zhikun Zhang, Sijia Jiang, Johan Liu and Masahiro Inoue, “Development of High Temperature Stable Isotropic Conductive Adhesives”, 9th International Conference on Electronic Packaging technology and High Density Packaging, Shanghai, China, July 2008
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Chalmers |
Johan Liu, Yifeng Fu and Teng Wang, “Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging”, 9th International Conference on Electronic Packaging technology and High Density Packaging, Shanghai, China, July 2008
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Chalmers
FOAB
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| Andras Vas-Varnai, Marta Rencz, “Testing the thermal resistance of thermal interface materials”, 1st International Symposium on Thermal Design and Thermophysical Property for Electronics, Tsukuba, Japan, 18-20 June 2008 |
BME |
Press Release
| Article |
Partner |
S. Demoustier and A. Ziaei, "NANOPACK - Nano Packaging Technology for Interconnect and Heat Dissipation", The Parliament Magazine’s Research Review, Issue 10, September 2009, p45
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TRT |
| "MicReD Plays Major Role in NANOPACK Research", Press Release in MicroWave Journal, Vol. 51, No 4, April 2008
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MicReD |
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Publications
