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Chalmers' workshop on “Thermal transport in electronics and MEMS"
On 26th February 2009, Chalmers organized a very successful workshop hold in Gothenburg on “Thermal transport in electronics and MEMS” . This event, sponsored by NANOPACK, the Swedish Foundation for Strategic Research (SSF) ProViking program, Swedish National Science Foundation, and IEEE CPMT Nordic chapter, gathered academic and industrial experts of thermal management issues in electronics and allowed to present the project and to establish contacts with external partners.
 
 Title  Speaker
 General introduction  Lars Frenning, Swedish Foundation for Strategic Research
 How to enhance productivity of Swedish electronics industry
 Prof Anders Kinnander, Chalmers University of Technology, Sweden
 Nanoscale Thermal transport
 Prof Gerald Mahan, Penn State University, USA
 Outcome from the first year work of the FP7 EU NANOPACK program on thermal dissipation  for Electronics and MEMS systems  Dr Afshin Ziaei and Sebastien  Demoustier , Thales Research, France
 Design of low-power integrated circuits
 Prof Per Larsson-Edefors, Chalmers University of Technology, Sweden
 Use of scanning probes for thermal transport measurements
  Dr Olivier Chapuis, ICN, Spain
 User's view: Barriers arising due higher level of integration in communication systems   Per Ingelhag, Ericsson, Sweden
 Thermal properties of example molecular nanostructures: Self-assembled quantum-dot arrays and nanowires connected to substrates
 Dr. Jean-Numa Gillet, University of Lille, IEMN, France
 Interface-limited thermal transport
 Prof Per Hyldgaard, Chalmers University of Technology, Sweden
 Development of Nano-Thermal Interface Materials for Heat dissipation in electronics and MEMS systems  Björn Carlberg, Chalmers University of Technology, Sweden
 Molecular dynamic modeling and simulation for thermal transport in electronics
 Dr Javier Goicochea, IBM Zürich,  Switzerland
 Use of Carbon Nanotubes for heat dissipation in electronics and MEMS systems
 Teng Wang, Chalmers University of Technology, Sweden
 Thermal Conductivity Measurement using Pulse Transient Hot Strip method  Mattias Gustavsson, Hotdisc AB, Sweden
 
 
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Project co-funded by the European Commission under the "Information and Communication Technologies" Seventh Framework Programme (2007-2013)
 
Contact: Dr. Afshin Ziaei, NANOPACK Coordinator, afshin.ziaei@thalesgroup.com