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IBM's workshop on thermal management

On 1st July 2009, IBM organized for the consortium a very successful workshop on keys aspects of thermal management and packaging issues in electronics from system point of view down to nanoelectronics.

 

 Title  Speaker
 Introduction Dr Afshin Ziaei, TRT
 Nanotechnology and Si nanowires overview
 Dr. Walter Riess, IBM, ZRL
Thermodynamics of datacenters and Green IT
 Dr. Bruno Michel, IBM, ZRL
More than Moore by (N)MEMS on CMOS
 Dr. Michel Despont, IBM, ZRL
Interlayer cooling in vertically integrated packages
 Thomas Brunschwiler, IBM, ZRL
Thermal management challenges in power electronics
 Dr. Bruno Agostini, ABB
Advance molecular modeling applications
 Dr. Alessandro Curioni, IBM, ZRL
Hybrid atomistic/continuum simulations of Carbon Nanotubes in water environment
 Dr. Jens Walther, ETH
Thermal transport modeling of a thin Si suspended membrane with stretched Ge quantum dots
 Dr. Jean-Numa Gillet, IEMN
Swiss Micro-Nanotechnology Network
 Dr. Peter Vettiger, CSEM & IMT EPFL, Neuchatel, Switzerland
 ISL Demo
  Dr. Maria Soimu
Molecular Simulation of Thermal Transport Prof. Müller-Plathe, Germany
 

 

 
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Project co-funded by the European Commission under the "Information and Communication Technologies" Seventh Framework Programme (2007-2013)
 
Contact: Dr. Afshin Ziaei, NANOPACK Coordinator, afshin.ziaei@thalesgroup.com